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Screen Printing
Solder paste is applied to the
PCBs using stainless steel stencils, varying in thickness from 0.004" to 0.008"
depending upon process requirements. This is the first step in the "Pick and
Place" process.
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Pick and Place
Pick and Place allows for a
component to be 'picked' from a feeder, then 'placed' onto the PCB with great accuracy,
repeatability, and efficiency. The reflow oven then 'reflows' the solder paste to create
perfect solder joints assuring process uniformity.
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Axial Insertion
For customers with through-hole
or mixed technology boards, costs are reduced by the use of NBI's Universal axial
insertion machine. Use of this machine gives customers repeatable accuracy at far less
cost than hand-load labor.
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Wave Solder
Through-hole technology (THT)
remains a solid design for many customers. Wave-soldering deposits solder at the leads of
all THT components.
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Stores
Materials are maintained in
controlled areas of the stockroom for both consignment and turnkey projects. |
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BGA
BGA technology in high volume
on the pick and place machine or in low volume on a BGA rework system. BGAs are 100
percent X-ray inspected.
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Hand Assembly
Precision hand-assembly of
surface mount technology allows for high-quality, quick turnaround on small volumes
and prototyping.
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Loading Lines
NBI performs hand loading of
through-hole components for many of our customers.
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