NBI Newsletter 2/2006:
NBI Announces Implementation of Lead-Free Service
NBI has completed preparations and capital equipment acquisitions for lead-free
processes. Customers may now receive RoHS compliant product.
Material Handling: All customer-specified RoHS materials are checked
at receipt for compliance. Containers with complying materials are specially marked with
green identifying labels. Printed circuit boards destined for lead-free processes are
clearly and individually identified as lead-free. These practices make lead-free materials
easy to distinguish from traditional inventory. Lead-free work orders are accompanied with
special travelers printed on green paper to highlight work requiring lead-free processes.
Pick and Place: NBI's pick and place process uses SAC-305 alloy solder
paste - the paste recommended by IPC. SAC-305 is 96.5 percent tin (SN), three percent
silver (AG), and one-half percent copper (CU). Special heat profiles are used in NBI's
ovens for reflowing the paste.
Wave Solder: NBI uses a Technical Devices
interchangeable-pot wave-soldering machine. One pot is filled with SAC-305 solder for RoHS
compliant wave soldering. The other pot is filled with traditional 63/37 tin-lead solder.
Pot changes can be made in as little as two hours. The machine has both top and bottom