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NBI Newsletter 11/2005:

NBI Announces Plans for Lead-Free Process Kick-Off

Capital Equipment: A new Technical Devices lead-free wave solder conversion system has been ordered and is scheduled for delivery next month. With the installation of this equipment, NBI will be able to offer both traditional and lead-free wave soldering processes on the same machine. The concept is very simple. The same wave solder machine can be used for both processes by swapping solder pots. This will accommodate product with or without lead-free requirements. Using the same machine for both processes will help control costs for customers. The system includes a titanium solder pot and pump assembly as well as a docking preheat station that will enable process changes from traditional to lead-free or from lead-free to traditional in a very short time.

Solder Alloy: NBI has chosen "SAC 305" for lead-free soldering operations. The "SAC 305" alloy has been recommended by IPC. This alloy is 96.5 percent tin (SN), three percent silver (AG), and one-half percent copper (CU).

Board Plating: NBI has reviewed IPC specifications, discussed customers' needs, and has also consulted with printed circuit board suppliers about alternatives for hot air solder level (HASL) plating on printed circuit boards. Based on our research, NBI will be offering three no-lead alternatives: silver emersion plating, gold emersion plating, and white tin plating.

Please contact NBI if you have questions about benefits and drawbacks about these alternatives.

Scheduled Start Date: NBI's official lead-free process implementation date has been set for January 16, 2006. NBI is currently accepting orders for product using the lead-free soldering process. For more immediate needs, contact NBI today.

NBI will continue to keep you posted about its progress with lead-free processes in coming issues of this newsletter.

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